专题:Semiconductor materials and devices

This cluster of papers focuses on the advances in atomic layer deposition (ALD) technology, particularly in the context of high-k dielectrics, gate oxides, and semiconductor devices. It covers topics such as thin film growth, dielectric breakdown mechanisms, metal gate transistors, interface engineering, and the impact of negative bias temperature instability (NBTI) degradation on device performance.
最新文献
Flexible Zr-doped hafnium oxide ferroelectric memcapacitive synaptic devices for neuromorphic computing

article Full Text OpenAlex

Electronic Materials and Devices

book-chapter Full Text OpenAlex

High-entropy-doping effect in a rapid-charging Nb2O5 lithium-ion battery negative electrode

article Full Text OpenAlex

Large‐Area Fabrication of Robust, Foldable MOF/ANF Membrane

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Investigation of optical, dielectric, and electrical properties of ZnO/cold sprayed Al system and their correlation with photovoltaic performance

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Electron displacement polarization of high-dielectric constant fiber separators enhances interface stability

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Low temperature deposition of functional thin films on insulating substrates enabled by selective ion acceleration using synchronized floating potential HiPIMS

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Single V2 defect in 4H silicon carbide Schottky diode at low temperature

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Multifunctional Tunnel Structural Interfacial Modulation Promises Fast-Charge and Long-Life Na-Layered Oxides

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Synergistic niobium and manganese co-doping into RuO2 nanocrystal enables PEM water splitting under high current

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近5年高被引文献
Pulsed Laser Deposition of Thin Films

book-chapter Full Text OpenAlex 3195 FWCI33.299

Fundamentals of Modern VLSI Devices

book Full Text OpenAlex 658 FWCI17.861

A step-by-step guide to perform x-ray photoelectron spectroscopy

article Full Text OpenAlex 621 FWCI52.636

Review of: "(Field effect nano transistors) Nano transistor electronic quantity and ionization potential)"

preprint Full Text OpenAlex 586 FWCI0

Review of: "FinFET nanotransistor downscaling causes more short channel effects, less gate control, exponential increase in leakage currents, drastic process changes and unmanageable power densities"

preprint Full Text OpenAlex 499 FWCI0

Coulomb interaction in thin semiconductor and semimetal films

book-chapter Full Text OpenAlex 495 FWCI107.484

Review of: "The field-effect tunneling transistor nMOS, as an alternative to conventional CMOS by enabling the voltage supply (VDD) with ultra-low power consumption,"

preprint Full Text OpenAlex 469 FWCI0

Review of: "The changes in the width of the nano transistor channel due to the field effect of the gate around can cause undesirable changes and loss of mobility"

preprint Full Text OpenAlex 468 FWCI0

Review of: "FinFET nanotransistor, the reduction of scale causes more short channel effects, less gate control, an exponential increase in leakage currents, severe process changes, and power densities"

preprint Full Text OpenAlex 462 FWCI0

Reactive boride infusion stabilizes Ni-rich cathodes for lithium-ion batteries

article Full Text OpenAlex 431 FWCI29.881